Microscale 3D Printing of Nanotwinned Copper

From Microscale Devices to 3D Printing

At the intersection of stem cell biology and tissue engineering resides enormous potential for patient-specific drug screening, disease modeling, and tissue equivalents that offer hope to treat some of the most devastating cardiovascular diseases. Tissue engineering comprises the optimization of 3 primary components: (1) the type or types of cells being implanted such as somatic cells, induced ...

Layering of Copper-ink using 3D Printing & Characterization

The use of nano materials, particularly copper is of interest, in areas like printed electronics and chemical engineering. Copper is highly conductive in nature and thin films on a substrate makes the structure more significant. Printing copper requires melting of macro size particles conventionally, whereas the viscous mixture of nano ink composition, utilizing spray mechanism in 3D printing f...

Bottom–Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via

This paper is the first to report a large-scale directcurrent electrodeposition of columnar nanotwinned copper within through silicon via (TSV) with a high aspect ratio (~4). With this newly developed technique, void-free nanotwinned copper array could be fabricated in low current density (30 mA/cm²) and convection conditions (300 rpm), which are the preconditions for copper deposition with a u...

Fracture in a thin film of nanotwinned copper

Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper.

Highly oriented [111] Cu grains with densely packed nanotwins have been fabricated by direct-current electroplating with a high stirring rate. The [111]-oriented and nanotwinned Cu (nt-Cu) allow for the unidirectional growth of Cu(6)Sn(5) intermetallics in the microbumps of three-dimensional integrated-circuit packaging; a uniform microstructure in a large number of microbumps of controlled ori...